Incoming material testing experimental equipment
1.High and low temperature cold and heat shock equipment: high and low temperature cold and heat shock experimental equipment, for kits and lamp beads, all have been tested for 72 hours at a low temperature of 60 degrees and a high temperature of 100 degrees; (simulate the use environment, observe the lamp beads, kits, Whether it can withstand low temperature and high temperature
2. Salt spray test equipment: Test the screw, after 100 hours of salt spray test, it will not rust or oxidize within 100 hours.
3. Oven: All LED lamp beads go through a 6-hour high-temperature oven before going on the production line to avoid wet soldering and oxidation of the lamp beads;
4. Waterproof test: the assembly workshop, the cabinets has passed the waterproof/shockproof test;
5. Vibration tester: All finished modules are subjected to random inspection vibration test (simulated transportation, whether there is any false welding);
6. Ultrasonic layered scanning: After the lamp beads and IC chips are passed through the furnace, layered scanning is performed to check whether there are faults and whether they are qualified;
7. PCB slice test and high-power microscope: Hole slice test has been done for PCB, hole copper, surface copper, meet the acceptance;
8. Resistance tester: test the copper content of the core of the power cord;
9. Load tester: test the load of the loaded power cord;
Shenzhen Blueshine Technology Co., Ltd.
Flat, no dark lines. Stable and longer-lasting.Starting from the PCB Making every screen stand up to the test.
PCB is the core raw material of LED displays. Shenzhen Blueshine Technology has achieved self-manufacturing across the entire process—from "base material → patterning → metallization → module"—keeping the initiative for overall screen uniformity and lifespan firmly in its own production lines.
Self-Manufacturing | Advanced Process | Full-Process Quality Control
Shenzhen Blueshine Technology PCB Differentiation Capabilities
· Process / Micron-Level Precision CircuitryLDI laser direct imaging + nano-graphite direct electroplating. Precision circuitry fabrication processes lead the industry standard, with uniform copper coverage in holes, low internal stress, and reliable conduction—supporting small-pitch and COB high-density packaging.
· Material / FR-4 Fiberglass BoardUtilizes FR-4 fiberglass board material: low water absorption, CAF-resistant, V-0 flame retardant. Structurally stable and highly reliable under long-term hot and humid environments. Board material can also be selected according to customer specifications.
· Smart Manufacturing / HDI Small-Pitch Mass ProductionThe group has built its own closed-loop production line. Four-layer, one-stage HDI small-pitch boards have achieved normalized mass production. Six-layer, two-stage HDI-COB samples have been delivered and recognized by customers. Higher-order HDI boards have prototyping capability.
· Quality / Full-Load Reliability VerificationStrict warpage control + dust-free high-speed SMT + DFM design + pre-shipment full-load reliability verification. Consistent across the entire screen, eliminating cold solder joints and dark/bright lines.
Shenzhen Blueshine Technology VS Ordinary Outsourced Module PCB
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Dimension
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Shenzhen Blueshine Technology (Self-Manufactured PCB)
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Ordinary Outsourced Module PCB
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Manufacturing & Process
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Manufacturing Model
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Factory-built production line; substrate + module closed loop in the same factory
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Outsourced template; incoming materials uncontrollable
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Circuit Precision
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LDI lithography technology; line width/spacing 40/30μm; minimum aperture 0.08mm
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Film exposure; mostly 100/100μm level
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Hole Metallization
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Nano-graphite direct electroplating; uniform copper in holes, low internal stress
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Traditional chemical copper deposition; reliability questionable when too thin
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Material & Reliability
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Board Performance
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FR-4 fiberglass substrate; low water absorption; low Z-axis expansion; stable dimensions; CAF-resistant, lead-free
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Conventional non-fiberglass substrate; high water absorption/expansion coefficient; weak CAF resistance
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Surface Treatment
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OSP organic solderability preservative; flat board surface, no exposed tin
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Some use tin spraying; surface uneven, easy solder bridging on fine pitches
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Flame Retardancy
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94V-0, self-extinguishing upon removal of flame
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Not reaching V-0; fire hazard spreads easily
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Design Specifications & Outgoing Quality
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Design Specifications
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Tailored to LED package + DFM + voltage drop optimization
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Generic board application; limited optimization
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Warpage
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Strictly controlled; uniform seams, flat screen surface
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Weak control; prone to dark/bright lines / local unevenness
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Aging Verification
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Full-load reliability verification (full-load aging screening) before shipment
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Sampling or no reliability verification
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Starting from a single board, upholding quality standards.Self-manufacturing, full-process control—making every LED screen stable, uniform, and as good as new for years to come.
